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Hole Conduction Process

Home > Hole Conduction Process

Information

Application：

It refers to electroless copper for vertical equipment, and serves for the deposition of a uniform layer of copper on hole of circuit board by chemical method to realize metallization for hole and provide copper plating with conduction conditions.

Advantage introduction：

Applicable to production demands for the boards with high aspect ratio and HDI, PTH bath load has wide applicable scope;

Stable PTH with high performance, compact PTH crystallization, good backlight effect;

PTH layer has good adhesive force and high thermal shock resistance;

PTH bath solution has low wastewater overflow, and is uneasy for copper sedimentation, indicating long maintenance period and good environmental friendliness.